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What we do

Research

Research Areas

Next-Generation Display IC Systems

Analog and mixed-signal circuits that enable scalable, high-frame-rate, and highly uniform next-generation displays, including TDDI, micro-LED, and quantum-dot systems.

Block diagrams of touch sensor and display driver IC signal chains.

Energy-Efficient Sensor Interfaces

All 13

Energy-efficient front-end amplifiers and data converters that translate physical signals such as light, temperature, impedance, pressure, and sound into robust digital information.

Sensor interface signal chain from physical sensing objects through amplification and analog-to-digital conversion.

Selected publications

  1. 2026 Major A-SSCC

    A 0.04 mm² BJT-Based Capacitively-Biased Diode Temperature Sensor with Filter-Assisted Active Noise Cancellation

    IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2026

  2. 2026 Major A-SSCC

    A 200-fps SPAD dToF LiDAR Sensor with In-Pixel Phase-Domain ΔΣ TDC and Dual-GRO Extended Counting

    IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2026

  3. 2025 OJ-SSCS

    Recent Advances in Energy-Efficient and Temperature-Resilient Sensor Interfaces

    IEEE Open Journal of the Solid-State Circuits Society, vol. 5, pp. 456–469, Nov. 2025

Miniaturized Sensor Platforms

All 5

Highly integrated sensor systems combining interfaces, memory, microcontrollers, power management, and clock generation for miniaturized intelligent sensing nodes.

Miniaturized sensor system integrating sensing, mixed-signal processing, wireless communication, and energy-efficient computing.

Selected publications

  1. 2022 Top-tier JSSC

    A Miniaturized Wireless Neural Implant with Body-Coupled Power Delivery and Data Transmission

    IEEE Journal of Solid-State Circuits, vol. 57, no. 11, pp. 3212–3227, Nov. 2022

  2. 2022 Top-tier JSSC

    A 0.9 V 28 MHz Highly Digital CMOS Dual-RC Frequency Reference with ±200 ppm Inaccuracy from −40 °C to 85 °C

    IEEE Journal of Solid-State Circuits, vol. 57, no. 8, pp. 2418–2428, Aug. 2022

  3. 2022 Top-tier ISSCC

    A Miniaturized Wireless Neural Implant with Body-Coupled Data Transmission and Power Delivery for Freely Behaving Animals

    IEEE International Solid-State Circuits Conference, pp. 340–341, Feb. 2022

Biomedical Circuits and Systems

All 7

Ultra-low-power neural and bioimpedance interfaces that connect flexible microelectrode arrays and implantable sensors to high-density electronic readout systems.

Capacitive neural interface concept and proposed high-density neural readout system.

Selected publications

  1. 2026 Top-tier VLSI

    A 256-Channel, 32-Interconnect, 1.25-NEF, In Vitro and In Vivo Neural Interface with Auto-Calibrated Input Impedance Boosting and On-Chip Spike Detection for Flexible Capacitive Microelectrode Array

    IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2026

  2. 2024 bioRxiv

    Code Multiplexed Nanocapacitor Arrays for Scalable Neural Recordings

    bioRxiv, Feb. 2024

  3. 2023 Top-tier VLSI

    A 1,024-Channel, 64-Interconnect, Capacitive Neural Interface Using a Cross-Coupled Microelectrode Array and 2-Dimensional Code-Division Multiplexing

    IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023