Faculty · SICSL
Woojun Choi, Ph.D.
Principal Investigator
IEEE MemberAssistant Professor, Department of Integrated Display Engineering
Prof. Woojun Choi leads the Smart Interface IC and Systems Laboratory at Yonsei University. His research focuses on high-performance analog and mixed-signal CMOS circuits for display IC systems, energy-efficient sensor interfaces, data converters, miniaturized sensor platforms, and intelligent biomedical systems.
Contact Information
-
Address
Room 150B-3, Engineering Research Park, Yonsei University, Seoul, Korea
-
Tel
-
Email
Education
-
Ph.D. in Electrical and Electronic Engineering
- Advisor: Prof. Youngcheol Chae
- B.S. in Electrical and Electronic Engineering
Experience
- Assistant Professor, Department of Integrated Display Engineering, Yonsei University, Korea (2025.03–Present)
- Assistant Professor, Department of Electronic Engineering, Kyung Hee University, Korea (2023.09–2025.02)
- Postdoctoral Researcher, Department of Information Technology and Electrical Engineering, ETH Zürich, Switzerland (2021.08–2023.08)
- Advisor: Prof. Taekwang Jang
- Postdoctoral Researcher, Department of Electrical and Electronic Engineering, Yonsei University, Korea (2021.03–2021.07)
- Visiting Scholar, Department of Electrical Engineering, Mathematics and Computer Science, Delft University of Technology, The Netherlands (2018.05–2018.08)
Honors and Awards
- Postdoctoral Fellowship, National Research Foundation of Korea (NRF) (2022.09–2023.08)
- International Solid-State Circuits Conference (ISSCC) 2021 Takuo Sugano Award for Outstanding Far-East Paper, IEEE ISSCC (2021.02) The Best ISSCC Paper Award for the Far-East Region
- Solid-State Circuits Society (SSCS) Predoctoral Achievement Award, IEEE SSCS (2019.02)
- Best Patent Award (Silver Prize), SK Hynix (2017)
- Global Ph.D. Fellowship, NRF (2016.03–2021.02)
Research output
Publications
2026
- Major Conference A-SSCC Energy-Efficient Sensor Interfaces
A 0.04 mm² BJT-Based Capacitively-Biased Diode Temperature Sensor with Filter-Assisted Active Noise Cancellation
IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2026
- Major Conference A-SSCC Energy-Efficient Sensor Interfaces Data Converters and In-Memory Computing
A 200-fps SPAD dToF LiDAR Sensor with In-Pixel Phase-Domain ΔΣ TDC and Dual-GRO Extended Counting
IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2026
- Top-tier Conference VLSI Biomedical Circuits and Systems
* Equal contribution authorship
IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2026
- Major Conference CICC Data Converters and In-Memory Computing
IEEE Custom Integrated Circuits Conference (CICC), April 2026
2025
- Journal OJ-SSCS Energy-Efficient Sensor Interfaces
Recent Advances in Energy-Efficient and Temperature-Resilient Sensor Interfaces
IEEE Open Journal of the Solid-State Circuits Society, vol. 5, pp. 456–469, Nov. 2025
2024
- Journal bioRxiv Biomedical Circuits and Systems
Code Multiplexed Nanocapacitor Arrays for Scalable Neural Recordings
bioRxiv, Feb. 2024
- Conference ICEIC Voltage and Frequency References
A Review on Integrated RC Frequency References for IoT Applications
IEEE International Conference on Electronics, Information, and Communication (ICEIC), Jan. 2024
2023
- Book Chapter Springer Voltage and Frequency References
RC Frequency References Based on Dual-RC FLLs
Biomedical Electronics, Noise Shaping ADCs, and Frequency References, Springer, Aug. 2023
- Top-tier Conference VLSI Biomedical Circuits and Systems
* Co-first authorship
IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023
- Top-tier Conference VLSI Energy-Efficient Sensor Interfaces
A Highly-Digital PWM-Based Impedance Monitoring IC with 143.2dB DR and 17.7fFᵣₘₛ Resolution
IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023
- Major Journal L-SSC Biomedical Circuits and Systems
* Co-first authorship
IEEE Solid-State Circuits Letters, vol. 6, pp. 25–28, Jan. 2023
2022
- Top-tier Journal JSSC Biomedical Circuits and Systems Miniaturized Sensor Platforms
A Miniaturized Wireless Neural Implant with Body-Coupled Power Delivery and Data Transmission
IEEE Journal of Solid-State Circuits, vol. 57, no. 11, pp. 3212–3227, Nov. 2022
- Top-tier Journal JSSC Voltage and Frequency References Miniaturized Sensor Platforms
IEEE Journal of Solid-State Circuits, vol. 57, no. 8, pp. 2418–2428, Aug. 2022
- Top-tier Conference VLSI Biomedical Circuits and Systems
* Co-first authorship
IEEE Symposium on VLSI Technology and Circuits, pp. 62–63, June 2022
- Top-tier Conference ISSCC Biomedical Circuits and Systems Miniaturized Sensor Platforms
IEEE International Solid-State Circuits Conference, pp. 340–341, Feb. 2022
2021
- Top-tier Journal JSSC Energy-Efficient Sensor Interfaces
A 64 × 64 SPAD-Based Indirect Time-of-Flight Image Sensor with 2-Tap Analog Pulse Counters
IEEE Journal of Solid-State Circuits, vol. 56, no. 10, pp. 2956–2967, Oct. 2021
- Top-tier Conference ISSCC Voltage and Frequency References Miniaturized Sensor Platforms
IEEE International Solid-State Circuits Conference, pp. 434–435, Feb. 2021 · Takuo Sugano Award for Outstanding Far-East Paper
2020
- Major Journal L-SSC Energy-Efficient Sensor Interfaces
A 40 m-Range 90 fps CMOS Time-of-Flight Sensor Using SPAD and In-Pixel Time-Gated Pulse Counter
IEEE Solid-State Circuits Letters, vol. 3, no. 11, pp. 422–425, Nov. 2020
- Major Conference CICC Energy-Efficient Sensor Interfaces
IEEE Custom Integrated Circuits Conference, Mar. 2020
2019
- Major Journal L-SSC Energy-Efficient Sensor Interfaces
IEEE Solid-State Circuits Letters, vol. 2, no. 9, pp. 67–70, Sep. 2019
- Top-tier Conference VLSI Energy-Efficient Sensor Interfaces
A 0.02 mm² 100 dB-DR Impedance Monitoring IC with PWM-Dual GRO Architecture
IEEE Symposium on VLSI Technology and Circuits, pp. C60–C61, June 2019
- Top-tier Conference VLSI Energy-Efficient Sensor Interfaces
IEEE Symposium on VLSI Technology and Circuits, pp. C256–C257, June 2019
2018
- Top-tier Journal JSSC Energy-Efficient Sensor Interfaces
IEEE Journal of Solid-State Circuits, vol. 53, no. 12, pp. 3356–3367, Dec. 2018
- Top-tier Conference ISSCC Energy-Efficient Sensor Interfaces
IEEE International Solid-State Circuits Conference, pp. 322–323, Feb. 2018
2017
- Top-tier Conference ISSCC Miniaturized Sensor Platforms
A 1 V 7.8 mW 15.6 Gb/s C-PHY Transceiver Using Tri-Level Signaling for Post-LPDDR4
IEEE International Solid-State Circuits Conference, pp. 402–403, Feb. 2017
2015
- Major Conference ESSCIRC Energy-Efficient Sensor Interfaces
IEEE European Solid-State Circuits Conference, pp. 267–270, Sep. 2015